HSMR-CL25 0.25mm blue leadframe-based surface mount chipled data sheet caution: HSMR-CL25 leds are class 1b esd sensitive per jesd22-a114c.01. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. description the HSMR-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. the hsmr- cl25 series is the thinnest available top emitting package in the market with high brightness ingan die technology. the leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40c to 85c despite its small size. the target applications are keypad backlighting, push button backlighting and status indicators. the target markets are mobile handsets, communications, ofce automation, industrial and commercial automations, home market appliances, networking, medical instruments, and mobile computing. this product is competitively priced, and production is geared towards short lead times and ample capacity. features ? small size top fring ? small 1.6 (l) x 0.8 (w) x 0.25 (h) mm package ? compatible with ir refow ? high brightness using ingan die technology ? available in 8mm tape on 7 (178 mm) diameter reels advantages ? high package thermal dissipation capability due to the superior package leadframe design ? small footprint to overcome space count ? low thickness to overcome space constrains ? short lead times and competitive pricing
2 package dimensions device selection guide package dimension (mm) die technology colors testing current (ma) parts per reel package description .6 (l) x 0.8 (w) x 0.25 (h) ingan blue 5 4000 untinted, non-difused notes: . all dimensions are in millimeters. 2. tolerance is 0. mm unless otherwise specifed. absolute maximum ratings at ta = 25c parameter HSMR-CL25 units dc forward current [] 0 ma power dissipation 39 mw reverse voltage (ir = 00 m a) 5 v led junction temperature 95 c operating temperature range -40 to +85 c storage temperature range -40 to +85 c soldering temperature see refow soldering profle (refer to figures 7 & 8 ) notes: 1. derate linearly as shown in figure 4.
3 light intensity (iv) bin limits bin id intensity (mcd) minimum maximum l .20 8.00 m 8.00 28.50 n 28.50 45.00 tolerance : 15% forward voltage (vf) bin limits bin id forward voltage (v) minimum maximum 2.55 2.75 2 2.75 2.95 3 2.95 3.5 tolerance : 0.1v color bin limits bin id dominant wavelength (nm) minimum maximum b 465.0 470.0 c 470.0 475.0 tolerance : 1nm electrical characteristics at ta = 25c part number forward voltage vf (volts) [1] @ if =5ma reverse breakdown vr (volts) @ ir = 100 m a min. thermal resistance r q j-pin (c/w) typ. typ. max. HSMR-CL25 2.85 3.5 5 300 notes: 1. vf tolerance : 0.1v optical characteristics at ta = 25c part number luminous intensity iv [1] (mcd) @ 5ma peak wavelength l peak (nm) typ. dominant wavelength l d [2] (nm) typ. viewing angle [3] () typ. min. typ. HSMR-CL25 .2 8 469 473 20 notes: 1. the luminous intensity iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the led package. 2. the dominant wavelength, l d, is derived from the cie chromaticity diagram and represents the perceived color of the device. 3. q 1/2 is the of-axis angle where the luminous intensity is ? the peak intensity.
4 figure 1. relative intensity vs. wavelength figure 2. forward voltage vs. forward current figure 3. luminous intensity vs. forward current figure 4. maximum forward current vs. ambient temperature figure 5. radiation pattern 0 10 20 30 40 50 60 70 80 90 100 400 450 500 550 600 650 700 wavelength - nm relative intensity - % 0.1 1 10 100 2.0 2.5 3.0 3.5 4.0 forward voltage - v forward current - ma 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 2 4 6 8 1 0 dc forward current - ma relative luminous intensity (normalized at 5 ma) 0 2 4 6 8 10 12 0 2 0 4 0 6 0 8 0 100 dc forward current - ma relative luminous intensity (normalized at 5 ma) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.1mm (0.004in.) unless otherwise specifed. figure 6. recommended soldering land pattern. 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031)
5 figure 8. recommended pb-free refow soldering profle. figure 9. reeling orientation. figure 7. recommended refow soldering profle temperature time 10 sec. max. 230 o c max. 140-160 o c 4 o c/sec max. over 2 min. 4 o c/sec max. -3 o c/sec max. 10.50 1.0 (0.413 0.039) 59.60 1.00 (2.346 0.039) ? 20.20 min. ( ? 0.795 min.) 6 ps 178.40 1.00 (7.024 0.039) 3.0 0.5 (0.118 0.020) 4.0 0.5 (0.157 0.020) 5.0 0.5 (0.197 0.020) ? 13.1 0.5 ( ? 0.516 0.020) 8.0 1.0 (0.315 0.039) notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.1mm (0.004in.) unless otherwise specifed. figure 10. reel dimensions. 100 sec. max. time temperature (acc. to j-std-020c) -6 ?c/ sec. max. 255 - 260 ?c 10 - 30 sec. 60 - 120 sec. 3 ?c/ sec. max. 3 ?c/ sec. max. 217 ?c 200 ?c 150 ?c x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction x x x x x
figure 11. tape dimensions figure 12. tape leader and trailer dimensions. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape. refow soldering: for more information on refow soldering, refer to application note an-1060, surface mounting smt led indicator components. storage condition: 5 to 30c @ 60%rh max. baking is required before mounting, if: 1. humidity indicator card is > 10% when read at 23 5c. 2. device expose to factory conditions <30c/60%rh more than 168 hours. recommended baking condition: 605c for 20 hours. part number dim. a dim. b dim. c HSMR-CL25 1.75 (0.069) 0.88 (0.035) 0.40 (0.016) 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2006 avago technologies limited. all rights reserved.. obsoletes av0 -0509en av0 -0704en - december 28, 2006
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